Drawing Capillaries and Die Bonding Tools (Semiconductor Bonding Tool)

I have a feeling that I should not include this topic because I can imagine that this will not be very useful to other discipline of AutoCAD users because mostly, Architectural and Civil engineering have the most user of AutoCAD. Just to share my little knowledge to the world wide web that such profession does exist. Many of my drawing are measured in microns ( metric unit of measurement) and mil (english unit of measurement: thousand of an inch) and the tolerances are so small, the smallest is 1 micron. Can you imagine that, you need a micro scope to see the tolerances.

This post is just an introduction and I will show the details on my later post. Just to give you a brief explanation about capillaries and die bonding tools, capillaries are small needle-like tool (See fig. 2) that bonds or weld thin gold wires inside the IC (integrated circuit) chips. A good example is the CPU of your computer. Aside from the flip chip technology( The flip chip connection is generally formed one of two ways: using solder or using conductive adhesive. See Amkor Flip Chip Packaging Technology Solution for more details), the IC are connected by wires to the lead frame( See Fig. 1 below).

Fig. 1

and this is how a capillary looks like and usually made from ceramic:

Fig. 2

Flip Chip vs Wire Bond

Fig. 3 – Standard Wire Bond IC Packaging andĀ Flip Chip Technology

Die boding tools (See Fig. 6) on the other hand are tools for die bonding process. It usually starts with Wafer Processing (Everything starts with a thin slice of material, usually silicon, but sometimes also Gallium Arsenide, Quartz, Glass, Lithium Tantalate, Lithium Niobate , etc. called wafer.). Then it will go on to die picking, epoxy dispensing, die placing, epoxy curing and wire bonding. To see the clear picture, check this The Basic Die Bonding Process.

Fig.6

So on my next posts you will see how I draw those little critters.

1 comment so far ↓

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